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LAN7500 USB 2.0转千兆以太网网卡芯片与方案

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“LAN7500 USB 2.0转千兆以太网网卡芯片与方案”参数说明

功能结构: 模拟集成电路 制作工艺: 半导体集成电路
导电类型: 双极型 外形: 扁平型
集成度高低: 为小规模集成电路 应用领域: 标准通用
封装: LQFP 2: 3
5: 2

“LAN7500 USB 2.0转千兆以太网网卡芯片与方案”详细介绍

LAN7500 USB2.0转千兆以太网芯片IC
Microchip's LAN7500 is a Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller providing a high-performance and cost-effective USB to Ethernet connectivity solution. The LAN7500 contains an integrated 10/100/1000 Gigabit Ethernet PHY, USB PHY, Hi-Speed USB 2.0 device controller, 10/100/1000 Gigabit Ethernet MAC, TAP controller, EEPROM controller and a FIFO controller with a total of 32KB internal packet buffering. The device supports 10BASE-T, 100BASE-TX and 1000BASE-T Ethernet and implements Control, Interrupt, Bulk-in and Bulk-out USB endpoints. The Ethernet controller supports auto-negotiation, auto-polarity correction, HP Auto-MDIX? support and is compliant with IEEE 802.3/802.3u/802.3ab standards.
USB-based networking provides flexibility for the routing and placement of network connections anywhere in the system. USB-based solutions leverage the existing USB stack for the Ethernet driver. The LAN7500 is also available with a wide range of drivers including Windows?, Mac? and Linux?.

The LAN7500 also offers Microchip’s NetDetach? and UniClock? technologies. NetDetach allows for up to a 25% reduction in power by enabling the host CPU to enter a low-power state when Ethernet is inactive. UniClock simplifies the clocking scheme and reduces system BOM cost by using a single 25MHz crystal for both USB and Ethernet connectivity. Multiple power management features are provided, including various low-power modes and Magic Packet?, Wake-on LAN (WOL) and Link Status Change wake events. These wake events can be programmed to initiate a USB remote wakeup. The device is available in commercial (0° to 70°C) and industrial temperature range (-40° to 85°C) options.
Microchip's complimentary and confidential LANCheck? and USBCheck? online design review services are available for customers who have selected our products for their application design-in*.

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